TSMC starts risk production on its A14 node, two years ahead of Intel's roadmap
First wafers are going to two unnamed customers. Volume production is planned for the second half of 2028, with a 15% performance gain over N2 at the same power.
Key points
TSMC told investors on Friday that its A14 process has entered risk production at Fab 20 in Hsinchu. Risk production is the stage where a small number of customer designs run on the line to check yields before full-scale manufacturing begins.
The company said A14 delivers up to 15% higher performance at the same power as N2, or 25–30% lower power at the same speed. Logic density rises by about 20%.
“Yields are tracking ahead of where N2 was at the same point in its development.”C.C. Wei, TSMC chief executive
Intel's comparable 14A node is scheduled for risk production in 2027 according to its most recent roadmap. Samsung has not given a date for its SF1.4 process.
What it means for devices
Phone chips are typically the first to adopt a new node. On past timelines, the first A14 phones would arrive in late 2028, with laptop and GPU parts following in 2029.